Company TH would like to introduce in detail the specifications of the product ECORELTM FREE 305-21
High reliability, lead free solder paste Halogen Free – Excellent solderability
ECORELTM FREE 305-21 is a No-Clean solder paste developed to offer very good wettability on different lead-free finishes, including OSP. Its large reflow process window allows for good soldering of medium and large boards with a wide range of component sizes. Due to its outstanding organic properties, ECORELTM FREE 305-21 can withstand multiple reflow cycles and offers low voiding. The solder joint is very shiny without graping even on very small deposits.
The radar chart below shows the excellent printing capabilities of ECORELTM FREE 305-21 which allow for high speed printing, excellent abandon time, long steady tackiness and good pin in paste capability.
After soldering, the flux residues remaining on the PCB are chemically inert. ECORELTM FREE 305-21 passes the Bono corrosion test. This is a key attribute to control the risk for electrochemical migration especially in electronics exposed to humidity and temperature.
STORAGE & PACKAGING
To ensure the best product performance, the recommended storage temperature range is from 5°C to 10°C. A shelf life of 12 months is achieved under these conditions. For cartridges the shelf life is 9 months. For an optimal preservation, store cartridges in vertical position, tip downwards.
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